ALINX HEA67 FPGA Development Board AMD Xilinx Zynq UltraScale+ RFSoC ZU67DR NVIDIA Jetson AGX Orin/Thor PCIe Gen3 x8 AI Platform

Overview

Product Description

The HEA67 development board combines an AMD Xilinx Zynq UltraScale+™ RFSoC ZU67DR with an NVIDIA Jetson AGX Orin or Thor module, connected via a PCIe Gen3 x8 interface with up to 80 Gbps bandwidth. The RFSoC core provides 8 channels of 14‑bit RF‑ADC (up to 2.95 GSPS) and 8 channels of 14‑bit RF‑DAC (up to 10 GSPS), plus 6 GB DDR4, 32 GB eMMC, and 256 MB QSPI Flash. For AI acceleration, the AGX Orin offers up to 275 TOPS (241 TOPS for the 32 GB version), while the Thor module delivers up to 2070 TOPS. This platform is ideal for direct RF sampling, 5G/radar systems, high-performance edge AI, and test & measurement applications.

Applications

● Software Defined Radio
● 5G Baseband & Wireless Infrastructure
● Radar & Electronic Warfare
● High‑speed Data Acquisition & Signal Processing
● Machine Learning & AI at the Edge
● Test & Measurement Equipment
● Emulation & Prototyping

Key Features

System-on-Module
● AMD Xilinx Zynq UltraScale+™ RFSOC ZU47DR
◆ 489K logic cells, 1872 DSP slices
◆ 8× 14‑bit RF‑ADC (max 2.95 GSPS)
◆ 8× 14‑bit RF‑DAC (max 10 GSPS)
◆ Quad‑core ARM Cortex‑A53 , dual‑core Cortex‑R5
● 6GB DDR4 SDRAM (4 GB PS + 2 GB PL)
● 256MB QSPI Flash
● 32GB eMMC Flash

RFSoC interface
● 8 x RF‑ADC / 8× RF‑DAC (SMP connectors)
● 2 x USB 3.0 Type‑C (Host/Slave)
● 1 x Gigabit Ethernet
● 1 x UART (Mini USB)
● 1 x Micro SD slot
● 1 x JTAG
● 4 x LED
● 4 x KEY
● 12V single supply
● Dimensions: 260 x 215 mm form factor
NVIDIA Jetson Orin / Thor Series System
● NVIDIA Jetson Thor Series Modules:
◆ Jetson Thor Series Modules 128 GB 256bit LPDDR5X memory: Up to 2070 TFLOPs.
(*Above Jetson modules are add-on options which need to be purchased separately. Please contact sales.online@alinx.com for more details.)● NVIDIA Jetson AGX Orin Module:
◆ Jetson AGX Orin Modules 64GB: Up to 275 TOPs.
◆ Jetson AGX Orin Modules 32GB: Up to 241 TOPs.
(*Above Jetson modules are add-on options which need to be purchased separately. Please contact sales.online@alinx.com for more details.)
GPU interface
● 1 x DP
● 1 x 10G Ethernet for NVIDIA JETSON AGX Orin Modules
● 1 x 5G Ethernet for NVIDIA JETSON Thor Series Modules
● 1 x M.2 SSD (M.2 Key M )
● 1 x M.2 WIFI/BT (M.2 Key E )
● 2 x USB3.2 Type-C
● 1 x EEPROM: 4-Kbit
● 1 x Micro SD 2.0 for NVIDIA JETSON AGX Orin Modules
● 40-pin connector

Product Information

Specifications
What's Inside

Board Features

Featuring the AMD/Xilinx Zynq UltraScale+ RFSoC XCZU67DR-2FFVE1156I

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq UltraScale+ RFSoC based application.

* The HEA67 development board consists of a ACW67 SoM and base board.

What's Inside the Box

ALINX AMD Xilinx Zynq UltraScale+ RFSoC XCZU67DR FPGA development board and Some accessories

The Heatsink Kit is an optimal cooling solution for FPGA devices – it is low-profile and covers the whole XCZU67DR device surface.

System-on-Module	1	Base Board	1
Type-C Cable	1	USB Downloader Cable / set	1
12V Power Adapter	1	Heatsink Kit (preinstalled)	1
SD Card	1	SMA Cable	2
Card Reader	1

Product Selection Matrix

Product Matrix

Product Model	FPGA Devices	DDR4 SDRAM	QSPI Flash	GTY 28.21Gbps	USD Price
HEA67	XCZU67DR-2FFVE1156I	6GB	256MB	8	14976
HEA67 + NVIDIA Jetson AGX Orin 32GB GPU Modules	XCZU67DR-2FFVE1156I	6GB	256MB	8	17971
HEA67 + NVIDIA Jetson AGX Orin 64GB GPU Modules	XCZU67DR-2FFVE1156I	6GB	256MB	8	19469
HEA67 + NVIDIA Jetson Thor T5000 Modules	XCZU67DR-2FFVE1156I	6GB	256MB	8	22464

1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.

We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.