ALINX HEA13 FPGA Development Board Xilinx Virtex Ultrascale+ XCVU13P NVIDIA Jetson AGX Orin/Thor PCIe Gen3 x8 AI Platform

Overview

Product Description

HEA13 is a high-performance heterogeneous computing development platform based on the AMD Xilinx Virtex UltraScale+ XCVU13P FPGA and the NVIDIA Jetson AGX Orin/Thor modules. The platform consists of the ACVU13 core board, the Jetson module, and a carrier board. The FPGA and the AI module are interconnected via PCIe Gen3 x8 for high-speed data exchange, enabling collaborative processing to meet the demands of cutting-edge applications such as high-speed data exchange, complex algorithm model validation, industrial real-time control, autonomous robotics, and multimodal large-model inference.

Applications

● Compute Acceleration
● Machine Learning and AI
● Network Acceleration
● Wired Communications
● 5G Baseband
● Radar
● Test and Measurement
● Emulation and Prototyping

Key Features

System-on-Module
● AMD Virtex Ultrascale+™ XCVU13P:
◆ 16nm FinFET FPGA fabric
◆ 3780K logic cells, 12,288 DSP slices
◆ 76 x GTY transceivers, up to 28.21 Gbps
◆ More than 2x faster system-level performance per watt compared to Kintex 7 FPGAs
● 2 x 10GB (80bit) DDR4 SDRAM
● 256MB QSPI Flash

FPGA interface
● 1 x NVIDIA Jetson AGX Orin / Thor Series Modules Interface
● 4 x 100Gbps QSFP28 connectors
● 2 x FMC+◆ FMC1+ has 122 FPGA IOs and 16 Lane GTY
◆ FMC2+ has 168 FPGA IOs and 16 lane GTY
● 1 x Gigabit Ethernet on PL
● 1 x UART
● 1 x Micro SD
● 2 x SMA (2 x in )
● 3 x LED
● 3 x KEY
● 12V single supply
● Dimensions: 271 x 200 mm form factor
NVIDIA Jetson Orin / Thor Series
● NVIDIA Jetson Thor Series Modules:
◆ Jetson Thor Series Modules 128 GB 256bit LPDDR5X memory: Up to 2070 TFLOPs.
(*Above Jetson modules are add-on options which need to be purchased separately. Please contact sales.online@alinx.com for more details.)● NVIDIA Jetson AGX Orin Module:
◆ Jetson AGX Orin Modules 64GB: Up to 275 TOPs.
◆ Jetson AGX Orin Modules 32GB: Up to 241 TOPs.
(*Above Jetson modules are add-on options which need to be purchased separately. Please contact sales.online@alinx.com for more details.)
GPU interface
● 1 x DP Interface
● 1 x 10G Ethernet for NVIDIA JETSON AGX Orin Modules
● 1 x 5G Ethernet for NVIDIA JETSON Thor Series Modules
● 1 x M.2 SSD interface
● 1 x M.2 WIFI/BT interface
● 2 x USB3.2 Type-C
● 1 x Micro SD
● 40-pin connector

Product Information

Specifications
What's Inside

Board Features

Featuring the AMD/Xilinx Virtex Ultrascale+™ XCVU13P-2FHGB2104I

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Virtex Ultrascale+™ based application.

* The HEA13 development board consists of a ACVU13 SoM and base board. If you want to purchase ACVU13 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.

What's Inside the Box

ALINX AMD Xilinx Virtex Ultrascale+™ XCVU13P FPGA development board and Some accessories

The Heatsink Kit is an optimal cooling solution for FPGA devices – it is low-profile and covers the whole XCVU13P device surface.

System-on-Module	1	Base Board	1
Mini USB Cable	1	USB Downloader Cable / set	1
12V Power Adapter	1	Heatsink Kit (preinstalled)	1
SD Card	1

Product Selection Matrix

Product Matrix

Product Model	Preferred Model	FPGA Devices	DDR4 SDRAM	QSPI Flash	GTY 28.21Gbps	USD Price
HEA13	√	XCVU13P-2FHGB2104I	20GB	2 x 128MB	76	14,976
HEA13 + NVIDIA Jetson AGX Orin 32GB GPU Modules	√	XCVU13P-2FHGB2104I	20GB	2 x 128MB	76	17,971
HEA13 + NVIDIA Jetson AGX Orin 64GB GPU Modules	√	XCVU13P-2FHGB2104I	20GB	2 x 128MB	76	19,469
HEA13 + NVIDIA Jetson Thor T5000 Modules	√	XCVU13P-2FHGB2104I	20GB	2 x 128MB	76	22,464

1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.

We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.