2026-09-01
ALINX has officially concluded its participation in AMD’s flagship event series, marking major milestones across executive strategy, global market engagement, and technology showcases. From executive-level discussions at the AMD Partner Summit to hands-on hardware demonstrations across the AMD Embedded Computing Summit (ECS) tour, ALINX continues to strengthen its strategic alignment with AMD in advancing edge AI and FPGA hardware acceleration.
Prior to the global ECS tour, ALINX CEO and the Director of Overseas Sales attended the AMD Partner Summit. The executive team met with senior AMD leaders and industry partners to discuss high-level strategic cooperation, next-generation product roadmap alignment, and joint market expansion for heterogeneous edge compute solutions. This participation highlights ALINX’s growing role as a trusted ecosystem partner within AMD's global embedded computing framework.
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Following the Partner Summit, ALINX launched its showcase tour at the AMD Embedded Computing Summit (ECS) 2026, engaging with engineers, system architects, and technology leaders across South Korea, India, and Japan. The summit series provided an international stage to demonstrate ALINX's latest FPGA hardware platforms, high-throughput video ingestion pipelines, and adaptable edge computing architectures.
（AMD ECS Bengaluru）
（AMD ECS Seoul）
（AMD ECS Japan）
During the summit stop in Bengaluru, India, on August 20th, ALINX was honored with an official appreciation memento from AMD, recognizing ALINX’s valued patronage, partnership, and technical demonstrations. Regional distributor Tenet Technetronics represented ALINX on-site, demonstrating live hardware capabilities and connecting directly with engineering teams across India's rapidly growing tech sector.
Throughout the summit tour, ALINX showcased its FPGA-Based CMOS Image Acquisition & USB® 3.2 High-Speed Video Acquisition Pipeline, designed to resolve data movement and latency bottlenecks in computer vision setups:
Hardware-Driven Data Ingestion — Executes pixel synchronization, buffering, and format conversion directly in hardware logic for microsecond-level latency.
Broad Sensor Interoperability — Native support for MIPI®, LVDS, and parallel inputs across RAW8–RAW16, YUV422, and RGB888 formats.
On-Chip Preprocessing — Performs real-time Bayer arrangement, ROI cropping, downsampling, grayscale conversion, and hardware timestamping.
High-Speed Transmission — Delivers plug-and-play USB® 3.2 streaming to edge AI platforms, PCs, and laptops.
Visitors across Korea, India, and Japan explored several of ALINX’s flagship hardware platforms engineered for industrial vision, medical imaging, robotics, and scientific cameras:
VD100 — Powered by the AMD Versal™ Prime VE2302 / VE2802 Adaptive SoC.
ACAU15 — Featuring the AMD Artix™ UltraScale+ AU15P FPGA for ultra-compact, high-density I/O.
FH7621 — High-performance FPGA processing board tailored for intensive multi-channel streaming.
The combined successes at the AMD Partner Summit and ECS 2026 tour underscore ALINX’s commitment to delivering reliable, industrial-grade FPGA SoMs and development kits worldwide. Moving forward, ALINX will continue deepening its technical collaboration with AMD and global distribution channels, powering the next generation of intelligent edge applications.
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