AXW47

AXW47 dev board & Kit with AMD Zynq™ US+ RFSoC XCZU47DR

The AXW47 development board is a high-performance RF signal processing platform based on AMD Xilinx Zynq UltraScale+ RFSoC, featuring 8 RF-ADC channels with up to 5 GSPS sampling and 8 RF-DAC channels with up to 9.85 GSPS sampling, designed for applications in wireless communications, radar systems, and test and measurement with rich peripheral interfaces including USB, Ethernet, and fiber optics.

Unit price

$ 13559

In stock:

>9, ready to ship in 2 workdays

Overview

AXW47-5.jpg

Product Description

The AXW47 development board adopts the Zynq UltraScale+ RFSoC Gen3 series XCZU47DR FPGA chip, integrating RF direct sampling data converters, FPGA logic, a complete ARM processor subsystem, and high-speed transceivers. It supports 8-channel 14-bit RF-ADCs with a maximum sampling rate of 5 GSPS, and 8-channel 14-bit RF-DACs with a maximum sampling rate of 9.85 GSPS. The RF input/output interfaces are designed for frequency bands up to 6 GHz. This provides a comprehensive RF signal chain, maximizing I/O channel density with high bandwidth, heterogeneous processing capabilities, and low power consumption. The carrier board expands an AMD XCKU115 pure-logic FPGA for backend data processing acceleration.


It meets the requirements of applications including 5G wireless infrastructure, cable TV access, test and measurement, satellite communications, phased-array radar/digital array radar, and other high-performance RF scenarios.

Applications



Key Features

Product Information

Development Board Features

Featuring the AMD/Xilinx's Zynq™ UltraScale+™ RFSoC XCZU47DR-2FFVE1156I Adaptive SoC

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ RFSoC based application.

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* The AXRF47 development board consists of a ACW47 SoM and base board. If you want to purchase ACW47 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.

What's Inside the Box

ALINX AMD Xilinx Zynq™ UltraScale+™ RFSoC ZU47DR development board and Some accessories

Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.

System-on-Module1Base Board1
Heatsink Kit (preinstalled)2Network cable1
Type-C cable1The power adapter1
Power adapter cable1SMA cable1
Data USB flash drive1SD card1


Product Selection Matrix

Product Matrix

Product ModelPreferred ModelFPGA DevicesDDR4 SDRAM (SoM)DDR4 SDRAM (Base Board)QSPI FlashRF-ADCRF-DACGTY                     GTR                     USD Price
AXW47XCZU47DR-2FFVE1156I6 GB16 GB256 MB888413559


1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.


We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.

Documentations

Related Products

Alinx Electronic Limited 沪ICP备13046728号

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