The AXW47 development board is a high-performance RF signal processing platform based on AMD Xilinx Zynq UltraScale+ RFSoC, featuring 8 RF-ADC channels with up to 5 GSPS sampling and 8 RF-DAC channels with up to 9.85 GSPS sampling, designed for applications in wireless communications, radar systems, and test and measurement with rich peripheral interfaces including USB, Ethernet, and fiber optics.
Unit price
$ 13559In stock:
>9, ready to ship in 2 workdays
The AXW47 development board adopts the Zynq UltraScale+ RFSoC Gen3 series XCZU47DR FPGA chip, integrating RF direct sampling data converters, FPGA logic, a complete ARM processor subsystem, and high-speed transceivers. It supports 8-channel 14-bit RF-ADCs with a maximum sampling rate of 5 GSPS, and 8-channel 14-bit RF-DACs with a maximum sampling rate of 9.85 GSPS. The RF input/output interfaces are designed for frequency bands up to 6 GHz. This provides a comprehensive RF signal chain, maximizing I/O channel density with high bandwidth, heterogeneous processing capabilities, and low power consumption. The carrier board expands an AMD XCKU115 pure-logic FPGA for backend data processing acceleration.
It meets the requirements of applications including 5G wireless infrastructure, cable TV access, test and measurement, satellite communications, phased-array radar/digital array radar, and other high-performance RF scenarios.
● 5G FR1/FR2 RF and baseband
● phased array system
● Radar System
● Software-Defined Radio
● Medical Imaging Systems
● Spectrum monitoring
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ RFSoC based application.
* The AXRF47 development board consists of a ACW47 SoM and base board. If you want to purchase ACW47 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.
Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
System-on-Module | 1 | Base Board | 1 |
---|---|---|---|
Heatsink Kit (preinstalled) | 2 | Network cable | 1 |
Type-C cable | 1 | The power adapter | 1 |
Power adapter cable | 1 | SMA cable | 1 |
Data USB flash drive | 1 | SD card | 1 |
Product Model | Preferred Model | FPGA Devices | DDR4 SDRAM (SoM) | DDR4 SDRAM (Base Board) | QSPI Flash | RF-ADC | RF-DAC | GTY | GTR | USD Price | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AXW47 | √ | XCZU47DR-2FFVE1156I | 6 GB | 16 GB | 256 MB | 8 | 8 | 8 | 4 | 13559 |
1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
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