AXRF49

AXRF49 Dev Board & Kit with AMD Zynq™ US+ RFSoC ZU49DR

The AXRF49 development kit comprises the ACRF49 SoM and the RFEVM200 base board, linked by a 56Gbps high-speed connector. The ACRF49 SoM features Xilinx's Zynq UltraScale+ RFSoC Gen3 XCZU49DR FPGA as its main chip, supporting 16-channel 14-bit RF-ADC with a maximum sampling rate of 2.5GSPS. And it includes a 16-channel 14-bit RF-DAC with a maximum sampling rate of 9.84GSPS.

Unit price

$ 20582

In stock:

>9, ready to ship in 2 workdays

Overview

AXRF49-6.jpg

Product Description

The AXRF49 development kit comprises the ACRF49 SoM and the base board, linked by high-speed connectors (32Gbps per channel). The ACRF49 SoM features Xilinx's Zynq UltraScale+ RFSoC Gen3 XCZU49DR FPGA, supporting 16-channel 14-bit RF-ADC (2.5GSPS max) and 16-channel 14-bit RF-DAC (9.85GSPS max). This integration simplifies the RF signal chain, maximizes I/O density without sacrificing bandwidth, leverages heterogeneous processing, and reduces power consumption. Connectors extend RF-ADC/RF-DAC interfaces, clocks, MIO, GTY transceivers, and support configurable IO voltages on specific banks.


Supporting 5G baseband, cable TV access, and wireless communication applications; test and measurement, radar/early warning systems, satellite positioning, and other high-performance RF scenarios.

Applications



Key Features

Product Information

Development Board Features

Featuring the AMD/Xilinx's Zynq™ UltraScale+™ RFSoC XCZU49DR-2FFVF1760 Adaptive SoC

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ RFSoC based application.

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* The AXRF49 development board consists of a ACRF49 SoM and base board. If you want to purchase ACRF49 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.

What's Inside the Box

ALINX AMD Xilinx Zynq™ UltraScale+™ RFSoC ZU49DR development board and Some accessories

Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.

System-on-Module1Base Board1
SMA cable8MCX-SMA RF cable16
MMCX-SMA RF cable412V power supply1
power line1USB3.0-cable1
Network cable1TF card1
card reader1CD materials1


Product Selection Matrix

Product Matrix

Product ModelDevice SeriesFPGA DevicesDDR4 SDRAM (PS)DDR4 SDRAM (PL)QSPI FlashRF-ADCRF-DACUSD Price
AXRF49Zynq UltraScale+ RFSoC Gen3XCZU49DR5 GB ECC5 GB128 MB16-channel16-channel20582


1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.


We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.

Documentations

Related Products

Alinx Electronic Limited 沪ICP备13046728号

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